Client Location: |
India |
Application Sector: |
Compact High-Density Electronic & RF Systems |
Project Background & Engineering Challenge
A leading electronics manufacturer in India approached Hotten Electronic Wire Technology (Jiangsu) Co., Ltd. (Hotten) with a requirement for a high-density, short-span internal interconnect assembly. The customer’s system architecture demanded 40 channels of 50-ohm impedance-matched signal transmission within an ultra-confined mechanical envelope.
The primary engineering challenges included:
Technical Specifications & BOM Architecture
To meet signal integrity and mechanical durability benchmarks, Hotten engineered a point-to-point harness utilizing genuine I-PEX micro-coaxial connector systems.
Component / Parameter |
Specification / Part Number |
Engineering Details |
Connector 1 & 2 (Plug) |
I-PEX CABLINE®-UA II (20496-040-40) |
40-Pin, fine-pitch micro-coaxial plug assembly (Qty: 2) |
Housing Assembly |
I-PEX (20497-040T-30) |
Precision alignment housing for 40P termination (Qty: 2) |
EMI Shielding Cover |
I-PEX (2679-040-10) |
Metal cover for 360° EMI suppression & mechanical lock (Qty: 2) |
Mating Receptacle Ref. |
I-PEX (20498-040E-41) |
Board-side mating interface reference |
Cable Type |
AWG#44 Micro-Coaxial Cable |
40 Cores, 50 Ω characteristic impedance, Blue jacket |
Overall Length |
127 mm ± 3.0 mm |
Center-to-center connector pitch tolerance controlled |
Overwrap / Bundling |
Black Acetate Tape |
62 mm ± 0 mm central wrap zone for bundle management |
Strain Relief / Potting |
UV-Curable Adhesive (UV Glue) |
Applied at termination bonding area (Max height: 1.50 mm) |
Process Control & Electrical Verification
At Hotten, sub-40AWG cable assemblies undergo strict process governance to eliminate impedance discontinuities and cross-talk:
1. I-PEX Standard Compliance: All stripping, soldering, and metal cover crimping procedures were executed in strict accordance with I-PEX Instruction Manual No. HIM-09006, ensuring zero mechanical deformation of the fine-pitch contacts.
2. Precision UV Bonding: A controlled micro-dispensing process applies UV glue across the termination bonding zone, locking all 40 AWG#44 coaxial shields and conductors into a unified, vibration-resistant structure within the 1.50 mm height envelope.
3. Pin-to-Pin Crossover Mapping: Verified 100% continuity for the custom pin assignment (e.g., Connector 1 Pos. 40 to Connector 2 Pos. 1; Pos. 38 to Pos. 2, etc.) with zero open/short defects.
100% Electrical Test Benchmarks:
Outcome
Hotten successfully delivered the custom 40-pin I-PEX CABLINE®-UA II micro-coaxial assemblies on schedule, passing all incoming electrical and dimensional inspections by the customer's engineering team in India. The solution provided reliable 50-ohm RF/high-speed signal transmission while meeting the exact spatial constraints of their next-generation hardware.
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